Solder paste flux composition
US7052558B1 · kind B1 · utility
1Cited by
23References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2005 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Apr 8, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3616
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering paste flux for use in soldering copper and copper alloy piping and the like is formed of 40–70% nonylphenol ethoxylate (preferably Tergitol NO-10® made by Dow Chemical), 10–30% glyceryl monostearate, 3–10% acid activator, 3–10% water, and 4–15% mineral salt. The acid activator is preferably a mineral acid and, most preferably, hydrobromic acid. The mineral salt is preferably zinc bromide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.