Pattern drawing method by scanning beam and pattern drawing apparatus
US7053387B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2003 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Dec 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31766
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A pattern drawing method of drawing a desired pattern on a base material by irradiating an electronic beam and scanning the base material with the electronic beam with a predetermined dose amount, comprising: a first step of drawing a first region on the base material by scanning with the electronic beam with a first dose amount; a second step of drawing a second region on the base material by scanning with the electronic beam with a second dose amount; and a inclining step of inclining a boundary between the first region and the second region to form an inclined surface by conducting a first scanning to scan with the electronic beam with the first dose amount and a second scanning to scan with the electronic beam with the second does amount in a mixed arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.