Multi-interface patch panel system
US7054163B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 13, 2003 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Feb 3, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q2201/16
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis. The modules include a housing and a module card. The card can include a variety of connections that provide communication to connections located on a back plane of the chassis. The system can include a combination of passive and active modules that are interchangeable to provide a variety of interface configurations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.