Methods and systems for laser processing a workpiece and methods and apparatus for controlling beam quality therein
US7054341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2003 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Feb 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/08072
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser processing methods, systems and apparatus having a super-modulating power supply (6) or pumping subsystem (5) and high beam quality (i.e., brightness) are disclosed. The methods, systems and apparatus have significant benefits, improved operation characteristics and material processing capability over currently available methods, systems and apparatus. In at least one embodiment, the beam quality of a high power solid state laser (2) is improved in the presence of thermal lensing. High power laser cutting, scribing, and welding results are improved with a combination of modulation and high beam quality while providing for improved processing speeds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.