Multilayer electronic component and communication apparatus and method
US7054608B2 · kind B2 · utility
1Cited by
4References
3Claims
0Family size
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Key dates
| Filing date | Jan 11, 2002 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Sep 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2001/0085
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component has a multilayered product laminating a plurality of dielectric sheets as one piece,
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.