Support system for semiconductor wafers and methods thereof
US7055229B2 · kind B2 · utility
4Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2003 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Dec 31, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53961
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer may be secured to a wafer support system by causing a supported surface of the semiconductor wafer to be at a lower gas pressure than an exposed surface of the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.