High efficiency cooling system and heat absorbing unit
US7055341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2003 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Jun 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The cooling system allows the liquid coolant discharged from the pump to flow into the evaporation chamber. The liquid coolant passes through the atomizer. Minute droplets of the atomized coolant is discharged from the atomizer into the evaporation chamber. The minute droplets serve to form a uniform thin liquid film over the surface of the fin. Heat conducting from a target heat generating object to the fin promotes the evaporation of the liquid coolant over the surface of the fin, for example. The coolant absorbs a large amount of heat from the fin based on the evaporation. The target heat generating object can thus efficiently be cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.