Contact grid array system
US7056131B1 · kind B1 · utility
25Cited by
103References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 11, 2003 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Apr 11, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A scalable, low cost, reliable, compliant, low profile, low insertion force, high-density, separable and reconnectable electrical connection for high speed, high performance electronic circuitry and semiconductors. The electrical connection can be used to make, for example, electrical connections from one Printed Circuit Board (PCB) to another PCB, MPU, NPU, or other semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.