Printed circuit embedded capacitors
US7056800B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2003 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Jul 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09718
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One of a plurality of capacitors embedded in a printed circuit structure includes a first electrode (415) overlaying a first substrate layer (505) of the printed circuit structure, a crystallized dielectric oxide core (405) overlaying the first electrode, a second electrode (615) overlying the crystallized dielectric oxide core, and a high temperature anti-oxidant layer (220) disposed between and contacting the crystallized dielectric oxide core and at least one of the first and second electrodes. The crystallized dielectric oxide core has a thickness that is less than 1 micron and has a capacitance density greater than 1000 pF/mm2. The material and thickness are the same for each of the plurality of capacitors. The crystallized dielectric oxide core may be isolated from crystallized dielectric oxide cores of all other capacitors of the plurality of capacitors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.