Adhesive composition for denture base relining material and dental curable composition
US7056961B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 3, 2001 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Dec 9, 2022 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61K6/35
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
An adhesive composition for a denture base relining material which comprises an organic solvent containing no halogen atoms such as ethyl acetate, ethyl formate or acetone, a polymer such as a copolymer of methyl methacrylate and ethyl methacrylate, and a radical polymerizable monomer such as tetramethylolmethane tetramethacrylate; and a curable composition which comprises a radical polymerizable monomer, an organic peroxide such as benzoyl peroxide, a tertiary amine compound such as diethyl-p-toluidine or dipropyl-p-toluidine, and a hydroxycarboxylic acid such as malic acid or citric acid.The adhesive composition for a denture base relining material does not contain a halogen-atom-containing organic solvent whose harmful effect has been pointed out. Further, the composition has satisfactory adhesive properties and good operability and causes no degradation in the appearance of a denture base even if it sticks to an area on the surface of the denture base other than a contact area. The dental curable composition is widely used as dental materials having little surface unpolymerized layer and good curability, e.g., dental cement, a composite resin, a resin for crown and a denture ba…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.