Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure

US7057134B2 · kind B2 · utility

Assignee

• LOMA LINDA UNIVERSITY MEDICAL CENTER · US

Inventors

• Paul E. Denney · Columbus, US
• Jay R. Eastman · Westerville, US
• Paul M. Fallara · Columbus, US
• Andrew P. Joseph · Johnstown, US
• John S. Phillips · Purchase, US
• Michael N. Patena · Pataskala, US
• Tim Burnham · Reynoldsburg, US
• Paul Coleman · Minneapolis, US

Key dates

• Filing date: Oct 22, 2003
• Grant date: Jun 6, 2006
• Expiry date: Dec 21, 2023

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/16
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A laser manipulation system controllably moves a laser head relative to a surface of an inhabitable structure for irradiating the surface with laser light from the laser head. The laser manipulation system includes a positioning mechanism coupled to the laser head. The positioning mechanism includes a first-axis position system adapted to move the laser head along a first direction substantially parallel to the surface. The positioning mechanism further includes a second-axis position system coupled to the first-axis position system and adapted to move the laser head along a second direction substantially parallel to the surface. The laser manipulation system further includes an anchoring mechanism coupled to the positioning mechanism and releasably coupled to the structure.