Method of precise laser nanomachining with UV ultrafast laser pulses
US7057135B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 4, 2004 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Jun 9, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y10/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a microstructure, which includes at least one feature having a dimension less than 200 nm, on a work piece. Pulses of UV laser light having a duration of less than about 1 ps and a peak wavelength of less than about 380 nm are generated. These pulses of UV laser light are focused to a substantially diffraction limited beam spot within a target area of the work piece. The fluence of this substantially diffraction limited beam spot in the target area of the work piece is controlled such that the diameter of the section of the target area machined by one of the pulses of UV laser light is less than 200 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.