Chip solid electrolytic capacitor
US7057882B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2005 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Sep 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G9/14
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip solid electrolytic capacitor includes a capacitor element with an anode portion and a cathode portion, an anode lead frame, a cathode lead frame and packaging resin. The anode lead frame includes a first plane, an anode junction and an anode terminal. The anode junction is formed on one end of the first plane and connected to the anode portion. The anode terminal is formed on the other side of the first plane. The cathode lead frame has a second plane and a cathode terminal. The second plane has the cathode portion mounted thereon, is connected to the cathode portion, and is stacked on the first plane. The cathode terminal is formed on the same side of the second plane as the anode terminal. The packaging resin has a surface to be mounted and covers the capacitor element, with the anode terminal and the cathode terminal exposed on the surface to be mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.