Systems and methods for thermal management of diode-pumped solid-state lasers
US7058100B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2002 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Jun 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/1317
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A solid-state laser system includes a solid-state laser having a laser gain medium and at least one pumping diode. The system also includes a thermal management system capable of placing a coolant in thermal communication with the solid-state laser such that the coolant can carry heat away from the solid-state laser. The thermal management system is then capable of rejecting the heat carried away by the coolant to a fluid at an ambient temperature, where the coolant can be at a temperature between 40° C. and 80° C. when the thermal management system rejects the heat. Advantageously, the thermal management system of the present invention can include reject the heat to a fluid comprising, for example, air or water. As such, the thermal management system does not require separate cooling of the fluid carrying the heat away from the coolant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.