Optical communication system with multiple photonic integrated circuit (PIC) chips and an external booster optical amplifier for photonic integrated circuits (PICs)
US7058248B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2004 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Jul 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4031
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A C- and/or L-band booster optical amplifier is utilized in an optical communication system at the output of one or more semiconductor transmitter photonic integrated circuit (TxPIC) chips or the optical combined outputs of multiple semiconductor transmitter photonic integrated circuit (TxPIC) chips employed in an optical communication module, the deployment of integrated semiconductor optical amplifiers (SOAs) on the TxPIC chips can be eliminated. This would reduce both the complexity in designing and fabricating these chips as well as reducing the power consumption of the TxPIC chips. The deployment of such a Tx booster optical amplifier would also take into consideration the nonlinear effects of difficult high loss single mode fiber (SMF) or other fiber type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted solely on the TxPIC chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.