Multiple evaporator heat pipe assisted heat sink
US7059391B2 · kind B2 · utility
12Cited by
13References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 7, 2005 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Apr 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions received in parallel channels in the base plate. A wall upstanding from the base plate between the channels is formed with an upright channel which receives the condenser portion substantially within the profile of the wall, so that a plurality of horizontal cooling fins can be fixed to the wall in thermal contact with the condenser portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.