Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductor device
US7059512B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2003 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Sep 21, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An object of the present invention is to provide solder bumps sufficiently satisfying the expected functions and having a small diameter which conventional methods cannot attain, a semiconductor device on which these bumps are mounted, and a bump transferring sheet. The present invention provides a method for forming the bumps, which includes forming a solder alloy material layer and flux material layer one by one on an intermediate metallic layer formed on an external electrode pad in a semiconductor device, and then fusing these layers, wherein each of the solder alloy material layer and flux material layer is formed by a liquid spraying method (e.g., ink jetting method).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.