Patent · US Expired

See-saw interconnect assembly with dielectric carrier grid providing spring suspension

US7059865B2 · kind B2 · utility

26Cited by
7References
32Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 16, 2004
Grant dateJun 13, 2006
Priority date
Expiry dateOct 20, 2024

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R3/00
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

An interconnect assembly includes a number of interconnects combined in a preferably planar dielectric carrier frame having resilient portions acting as spring members in conjunction with their respective interconnect's rotational displacement during operational contacting. Each interconnect is fabricated as a see-saw structure pivoting around a rotation axis that substantially coincides with a symmetry plane of the torsion features provided by the resilient portion. The torsion features protrude towards and adhere to a central portion of the see-saw interconnect such that an angular movement of the interconnect is resiliently opposed by the torsion feature and the resilient portion. The torsion features and interconnects may be independently optimized to provide the interconnect with maximum stiffness and a maximum deflection at same time.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.