Polishing pad conditioner and monitoring method therefor
US7059939B2 · kind B2 · utility
1Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2004 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Sep 2, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad conditioner for a chemical mechanical polishing apparatus and real-time monitoring method thereof. A conditioning head is supported for rotation at one end of a transverse beam. A drive assembly is coupled to the conditioning head to drive downward force to the conditioning head, and at least one sensor disposed on the transverse beam detects deflection of the transverse beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.