Patent · US Expired

Micromechanical mass flow sensor and method for the production thereof

US7060197B2 · kind B2 · utility

4Cited by

8References

7Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Matthias Fuertsch · Gomaringen, DE
Frank Fischer · Mesa, US
Lars Metzger · Albstadt, DE
Frieder Sundermeier · Kornwestheim, DE

Key dates

Filing date	Jun 8, 2002
Grant date	Jun 13, 2006
Priority date	—
Expiry date	Nov 21, 2022

Classification

Technology area (CPC G)Physics
CPC primaryG01F1/6845
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

In a mass flow sensor having a layered structure on the upper side of a silicon substrate (1), and having at least one heating element (8) patterned out of a conductive layer in the layered structure, thermal insulation between the heating element (8) and the silicon substrate (1) is achieved by way of a silicon dioxide block (5) which is produced beneath the heating element (8) either in the layered structure on the silicon substrate (1) or in the upper side of the silicon substrate (1). As a result, the sensor can be manufactured by surface micromechanics, i.e. without wafer back-side processes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.