Piezoelectric device and cover sealing method and apparatus therefor, cellular phone apparatus using piezoelectric device and electronic apparatus using piezoelectric device
US7060520B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2003 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | May 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/026
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The invention provides a method of sealing piezoelectric devices with covers capable of rapidly and securely sealing a plurality of packages or many packages of piezoelectric devices with covers. A piezoelectric device includes a package in which a piezoelectric vibrating reed is partially supported and fixed, and a cover fixed to the packages. In a method of sealing the packages with the covers, a plurality of the packages are arranged with the bottoms facing halogen lamps, so that the bottoms are irradiated with the light beams from the halogen lamps to thermally melt a brazing material disposed between the packages and the covers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.