Method and apparatus for material processing

US7060932B2 · kind B2 · utility

Assignee

• LOMA LINDA UNIVERSITY MEDICAL CENTER · US

Inventors

• Paul E. Denney · Columbus, US
• Jay R. Eastman · Westerville, US
• Paul M. Fallara · Columbus, US
• Andrew P. Joseph · Johnstown, US
• John S. Phillips · Purchase, US
• Ta-Chieh Huang · Dublin, US
• Michael N. Patena · Pataskala, US
• Tim Burnham · Reynoldsburg, US
• Paul Coleman · Minneapolis, US

Key dates

• Filing date: Oct 22, 2003
• Grant date: Jun 13, 2006
• Expiry date: Dec 21, 2023

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/1464
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

An apparatus processes a surface of an inhabitable structure. The apparatus includes a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit includes a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes a laser manipulation system which includes an anchoring mechanism adapted to be releasably coupled to the structure and a positioning mechanism coupled to the anchoring mechanism and coupled to the laser head. The laser manipulation system is adapted to controllably adjust the position of the laser head relative to the structure. The apparatus further includes a controller electrically coupled to the laser base unit and the laser manipulation system. The controller is adapted to transmit control signals to the laser base unit and to the laser manipulation system in response to user input.