Solderless component packaging and mounting
US7061076B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 12, 2004 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Aug 12, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for providing three-dimensional carrier mounting of one or more electronic components. In accordance with one embodiment, the device mounting apparatus of the present invention includes an elastically resilient plastic substrate having component mounting surfaces in at least two dimensions. At least one press-fit component insertion cavity is disposed within the component mounting surfaces to provide compressive retention of the electronic component when press-fit into the cavity. Preferably, the cavity has a depth such that when the component is press-fit, it does not extend above the surface plane of the cavity. The insertion cavity is further characterized as including at least one conductive trace disposed on an inner surface of said insertion cavity and positioned on the insertion cavity surface such that the conductive trace contacts at least one lead of the electronic device retained within the insertion cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.