Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
US7061081B2 · kind B2 · utility
11Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2001 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Nov 8, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.