System and method for cooling components in an electronic device
US7061761B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2004 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Dec 31, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In certain embodiments, a system for cooling components of an electronic device includes a chassis having a base, sides, and a removable cover disposed over the sides; a first component, a second component, and a third component disposed in the chassis; and a duct disposed in the chassis. In some embodiments, a duct includes a passage, an inlet to the passage, and an outlet from the passage, wherein the passage is disposed over the first component but not over the second and third components; and an upper member disposed against the removable cover lengthwise along the duct, wherein the duct and the upper member are configured to separate the second component from the third component in substantially different regions within the chassis. In particular embodiments, the system also includes a fan disposed angularly in the duct, such that the fan can provide an airflow in an angular direction relative to the first component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.