Combination IGBT mounting method
US7061766B2 · kind B2 · utility
17Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2004 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Dec 11, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method for providing a mechanical joint supporting a printed circuit board and a solder joint of power module terminals to a printed circuit board, as well as a mechanical joint for facilitating a thermal interface between a power module and a heat sink or cold plate is disclosed. The system provides for both mechanical joints through a common mechanical support including a plurality of standoffs mounted to studs projecting from a heat sink or cold plate, wherein the assembly also provides for an insulating spacer to be clamped to the standoffs via a wing nut or similar fastener to support the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.