Layered board, and apparatus incorporated such layered board
US7062117B2 · kind B2 · utility
11Cited by
3References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 31, 2005 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Aug 31, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a layered board, an insulating layer is interposed between a first layer capable of transmitting an electrical signal or an optical signal and a second layer capable of transmitting the electrical signal or the optical signal, interconnection of the signal between the first layer and the second layer is established through a signal connecting path penetrating the insulating layer, and the signal connecting path has both a function of transmitting the electrical signal and a function of transmitting the optical signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.