Method for predicting adhesive interactions using molecular modeling
US7062421B2 · kind B2 · utility
1Cited by
9References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 17, 2002 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Jun 22, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG16C20/30
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to a process for using computerized molecular interaction modeling to predict the adhesive interactions between a substrate and a polymer. The molecular modeling method may be used to predict and select optimal adhesion promoting monomers for use in latex polymer coatings, providing the best wet adhesion to alkyd-coated substrates. The molecular modeling method could also predict substrate polymer pairs having the least affinity, and thus the most useful as a release liner. The method involves the steps of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.