Heat dissipation device having cap for protecting thermal interface material thereon
US7063136B2 · kind B2 · utility
11Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2005 |
| Grant date | Jun 20, 2006 |
| Priority date | — |
| Expiry date | Aug 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat sink (10), thermal interface material (30) spread on a bottom surface (16) of the heat sink, two legs (22) of a clip (20) disposed at opposite sides of the heat sink, and a protective cap (40) enclosing the thermal interface material therein. The protective cap includes ears (48) interlocked with the legs of the clip to retain the protective cap to the heat sink. The legs of the clip are also used for interlocking with engaging member (52) on a printed circuit board (50) thereby firmly mounting the heat sink to a CPU (54) on the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.