Methods of cleaning copper surfaces in the manufacture of printed circuit boards
US7063800B2 · kind B2 · utility
2Cited by
22References
13Claims
0Family size
Inventors
Key dates
| Filing date | Nov 10, 2003 |
| Grant date | Jun 20, 2006 |
| Priority date | — |
| Expiry date | Feb 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0796
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.