Laser based method and device for forming spacer structures for packaging optical reflection devices
US7064045B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2004 |
| Grant date | Jun 20, 2006 |
| Priority date | — |
| Expiry date | Aug 30, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/047
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for forming a patterned silicon bearing material, e.g., silicon substrate. The method includes providing a silicon substrate, which has a surface region and a backside region. The method includes forming a plurality of recessed regions on the surface region. Each of the plurality of recessed regions has a border region. Preferably, the plurality of recessed regions forms a patterned surface region. The method includes bonding (e.g., hermetic bonding or on-hermetic seal) the patterned surface region to a handle surface region of a handle substrate, e.g., glass substrate. Each of the border regions, which protrude outwardly from the recessed regions, is bonded to the handle surface region, while each of the recessed regions remain free from attachment to any surface of the handle surface region. The method includes applying electromagnetic radiation comprising a laser beam to selected regions on the backside to ablate a thickness of silicon substrate overlying each of the recessed regions. The method also includes releasing a thickness of material defined within the recessed region while maintaining each of the border regions bonded to the handle surface region to form a plu…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.