Method to improve planarity of electroplated copper
US7064068B2 · kind B2 · utility
198Cited by
5References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2004 |
| Grant date | Jun 20, 2006 |
| Priority date | — |
| Expiry date | Jun 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/423
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Narrow trenches in a substrate tend to fill more rapidly than wide trenches This results in a non-planar surface once all trenches have been filled. The present invention solves this problem by performing the electro-deposition in two steps. The plating bath used during the first step, is optimized for filling narrow trenches while the plating bath used during the second step, is optimized for filling wide trenches. The net result is a final layer having a planar surface, with all trenches being properly filled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.