Optical surface mount technology package
US7064424B2 · kind B2 · utility
6Cited by
0References
28Claims
0Family size
Inventor
Key dates
| Filing date | May 6, 2004 |
| Grant date | Jun 20, 2006 |
| Priority date | — |
| Expiry date | Jul 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a package substrate, an optical device die atop the package substrate, a transparent optical element atop the die, an optional dam around the die, and an encapsulant entirely covering the die and partially covering the transparent optical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.