Area array semiconductor device and electronic circuit board utilizing the same
US7064451B2 · kind B2 · utility
3Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2003 |
| Grant date | Jun 20, 2006 |
| Priority date | — |
| Expiry date | Oct 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An area array semiconductor device is constituted of a circuit wiring substrate having a circuit wiring and a semiconductor chip mounted on the circuit wiring substrate and electrically connected with the circuit wiring. A sealing layer composed of a sealing resin is formed such that the sealing layer has an angle of 30° to 60° with respect to a side of the circuit wiring substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.