Interposer probe and method for testing
US7064567B2 · kind B2 · utility
2Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2004 |
| Grant date | Jun 20, 2006 |
| Priority date | — |
| Expiry date | Aug 12, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07378
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An interposer probe includes a main board having a first side and a second side. A lower riser board mounted to the first side of the main board and in electrical contact therewith is configured to engage an integrated circuit socket on a device to be tested. An upper riser board mounted to the second side of said main board and in electrical contact therewith, is configured to receive an integrated circuit package. A retention frame mounted to the first side of said main board engages the integrated circuit socket on the device to be tested.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.