Method and apparatus for temperature compensation
US7064617B2 · kind B2 · utility
24Cited by
74References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2004 |
| Grant date | Jun 20, 2006 |
| Priority date | — |
| Expiry date | Jun 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03L2207/50
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Temperature compensation is achieved by adjusting a divide ratio of a multi-modulus divider circuit in a feedback path of a phase-locked loop based on the detected temperature. The divide ratio is adjusted based on stored adjustment values stored in non-volatile memory. Interpolation may be used to interpolate between the stored adjustment values.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.