Redundant power for processor circuit board
US7064955B2 · kind B2 · utility
8Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2004 |
| Grant date | Jun 20, 2006 |
| Priority date | — |
| Expiry date | Jan 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1056
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least one processor coupled to and disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the processor, and provides an airflow path. First and second power systems are coupled to the second PCB and in a pathway of the airflow path. The first and second power systems are redundant such that upon failure of the first power system, the second power system can provide power for both power systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.