Methods and apparatus for securing a heat sink to a circuit board component
US7064957B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2003 |
| Grant date | Jun 20, 2006 |
| Priority date | — |
| Expiry date | Feb 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink attachment mechanism includes a fastener having an associated compressible member. The fastener defines a flange that, as the fastener secures a heat sink to a circuit board component, is configured to contact a circuit board surface associated with the circuit board component. Contact between the flange and the circuit board minimizes the travel of the fastener relative to the circuit board component and limits the stress generated on the circuit board component or on the solder balls of a ball grid array associated with the circuit boards component by the heat sink. Also, as the fastener secures the heat sink to the circuit board component, the fastener compresses the compressible member against the heat sink, thereby causing the compressible member to expand. Expansion of the compressible member allows the compressible member to absorb changes in the stress applied by the fastener to the heat sink and circuit board component over time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.