Pressure-measuring configuration, with a throughplating through a separator located between a diaphragm and a base, as well as a process for providing the electrical contact
US7066030B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 4, 2004 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | May 4, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0075
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Process for contacting diaphragm electrode (6) for pressure-measuring configuration. Connection of diaphragm (3) on which diaphragm electrode (6) is positioned to base (1) by connecting element (2) made of electrically insulating material running between the two. Base exhibits throughplating hole (7, 10) between attachment point (8) and connecting point (9) for electrically insulating material, and connecting element (2) exhibits connecting element throughplating (11) between connecting point (9) and diaphragm or diaphragm electrode. Conductive contact material (13) is provided in throughplating hole (7, 10). Contact material (13) is activated by heating. Throughplating (11) is prepared through connecting element (2) without forming opening that weakens material and without needing to align diaphragm, connecting element, and base with respect to throughplating holes. Contact material (13) is a material from which ions penetrate insulating material upon heating and render insulating material conductive to form connecting element throughplating (11).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.