Patent · US Expired

Method of joining components

US7067345B2 · kind B2 · utility

4Cited by

3References

20Claims

0Family size

Inventors

Edvard Kalvesten · Stuvsta-Snättringe, SE
Göran Stemme · Stockholm, SE
Frank Niklaus · Täby, SE

Key dates

Filing date	Jan 17, 2001
Grant date	Jun 27, 2006
Priority date	—
Expiry date	Mar 15, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1092
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of combining components to form an integrated device, wherein the components are provided on a first sacrificial wafer, and a second non-sacrificial wafer, respectively. The sacrificial wafer carries a first plurality of components and the non-sacrificial wafer carries a second plurality of components. The wafers are bonded together with an intermediate bonding material. Optionally the sacrificial wafer is thinned to a desired level. The components of the sacrificial wafer are electrically interconnected to the component(s) on the non-sacrificial wafer. Finally, optionally the intermediate bonding material is stripped away.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.