Semiconductor cooling system and process for manufacturing the same
US7067913B2 · kind B2 · utility
0Cited by
5References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2004 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Aug 13, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer spreading out heat generated from the microprocessor, and thereby effectively thermally conducting heat away from the microprocessor. Further, a semiconductor thermoelectric module can be utilized to further cool the microprocessor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.