Piezoelectric/electrostrictive film device, and manufacturing method of the device
US7067961B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2003 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Mar 3, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/785
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
There is disclosed a piezoelectric/electrostrictive film device which has a flexural displacement and durability equal to or more than those of a related-art piezoelectric/electrostrictive film device and which has a remarkably high resonance frequency and which is superior in high-speed response. The piezoelectric/electrostrictive film device comprises: a substrate formed of ceramic; and a piezoelectric/electrostrictive operation portion including a lower electrode, piezoelectric/electrostrictive layer, and upper electrode which are successively stacked on the substrate and including a projecting end of the piezoelectric/electrostrictive layer with which an upper surface of the lower electrode and a lower surface of the upper electrode are coated, and a projecting portion of the piezoelectric/electrostrictive layer is a coupling member constituted of a hybrid material in which inorganic particles are scattered in a matrix of a polymer compound, and is coupled to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.