System and method for the probing of a wafer
US7068056B1 · kind B1 · utility
16Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2005 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Jul 18, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a method for probing a wafer includes providing a plurality of pressure sensors on a surface of a probe card holding tray, positioning a probe card of a testhead relative to a prober supporting a wafer, engaging the probe card with the probe card holding tray, receiving a plurality of pressure signals from respective pressure sensors, and comparing the pressure signals to determine if the probe card is substantially parallel with the prober.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.