Implantable co-fired electrical interconnect systems and devices and methods of fabrication therefor
US7068491B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2005 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Sep 15, 2025 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/3754
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention includes a family of miniaturized, hermetic electrical feedthrough assemblies having at least one passive electrical component electrically coupled to a conductive pathway traversing each said assembly which are adapted for implantation within a biological system. The electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device (IMD) such as an implantable pulse generator, cardioverter-defibrillator, physiologic sensor, drug-delivery system and the like. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. Such an assembly is fabricated by interconnected electrical pathways, or vias, of a conductive metallic paste disposed between ceramic green-state material. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one embedded metallization pathway extending through the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.