Heat dissipation device incorporating with protective cover
US7068512B2 · kind B2 · utility
13Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2004 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Feb 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a core including a base with a bottom face and a top face and a body extending from the top face of the base, thermally conductive medium spread on the bottom face fo the base, a plurality of fin stacked along the body above the base, and a protective cover firmly disposed around the base of the core. An offset exists between the bottom face of the cover and the spread area of the medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.