Fixing apparatus for mounting a heat sink to a printed circuit board
US7068513B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2005 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Oct 5, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fixing apparatus includes a retention module (10) and a back plate (30). The retention module is attached on a printed circuit board (20), which defines a plurality of through apertures (22). The retention module comprises a plurality of posts (12) depending therefrom. Each post is hollow and aligned with a corresponding through aperture. The back plate is attached on a bottom surface of the printed circuit board, for reinforcing the printed circuit board. The back plate comprises a plurality of upwardly extending poles (32). The poles extend through the through apertures and lock inside of the posts to secure the retention module and the back plate on opposites sides of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.