Multi-chip module with stacked redundant power
US7068515B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2004 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Feb 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for providing power to the module. A second power system provides power to the module and is coupled, in a vertically stacked configuration, to the first power system. Each power system serves as a duplicate for preventing failure of the module upon failure of one of the power systems. A thermal dissipation device is disposed between both the first and second power systems and the first power system and module such that the thermal dissipation device dissipates heat, via heat exchange, away from the processors, the first power system, and the second power system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.