Method for producing a circuit board
US7069645B2 · kind B2 · utility
15Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2002 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | Jun 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.