High-density fiber-optic module with multi-fold flexible circuit
US7070341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2002 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | Apr 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A flexible printed circuit board (FPCB) for fiber optic modules includes a board with multiple bends, forming a structure with sides and a bottom. The traces in the FPCB traverse from the opto-electronic chips, through the sides of the FPCB, to the module interconnects at the bottom. The multi-fold structure allows the FPCB to support a higher number of traces than conventional single-fold FPCB's, and it allows the fanning out of signal traces from the opto-electronic and electronic chips at the front of the fiber-optic module, thereby reducing the crosstalk between the traces. This higher number is provided with a FPCB that features a single insulating layer and without the need to criss-cross the traces, resulting in improved signal integrity over conventional multi-layer FPCB's.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.