Method for forming ceramic thick film element arrays
US7070669B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2004 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | Dec 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/097
Abstract
An improved process for producing ceramic thick film array elements is provided. In this regard, ceramic elements are formed on a temporary, or printing, substrate by screen printing or other forming methods. The temporary, or printing, substrate is advantageously provided with a release layer. This makes it possible to release the printed and soft-baked ceramic elements from the temporary substrate and transfer the ceramic elements to the sintering substrate. The contemplated release technique takes advantage of the phase transition of a liquid, e.g. water, to transfer the elements to a sintering substrate. After sintering and electrode deposition, the ceramic element array is bonded to a target substrate. Then, the sintering substrate is removed to make the array available for implementation in a variety of suitable environments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.